Month: July 2019

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BS EN IEC 61188-6-4:2019 Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

Printed-circuit boards
Design
Electronic equipment and components
Dimensional tolerances
Integrated circuits
Dimensions
Printed circuits
Soldering

Link: BS EN IEC 61188-6-4:2019 Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Source: BSI Standards

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BS ISO/IEC 29167-19:2019 Information technology. Automatic identification and data capture techniques Crypto suite RAMON security services for air interface communications

Interfaces
Security personnel
Identification methods
Data processing
Information technology

Link: BS ISO/IEC 29167-19:2019 Information technology. Automatic identification and data capture techniques Crypto suite RAMON security services for air interface communications
Source: BSI Standards

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BS EN IEC 62812:2019 Low resistance measurements. Methods and guidance

Approval testing
Thick-film devices
Dissipation factor
Terminology
Endurance testing
Ratings
Thin-film circuits
Thick-film circuits
Detail specification
Environmental testing
Resistors
Circuits
Statistical quality control
Marking
Testing conditions
Specification (approval)
Temperature coefficient of resistance
Handbooks
Assessed quality
Integrated circuits
Performance
Inspection
Fixed resistors
Quality assurance systems
Capability approval
Rated voltage
Electrical tolerances
Thin-film devices
Electrical testing
Electronic equipment and components
Electrical components
Qualification approval
Environment (working)

Link: BS EN IEC 62812:2019 Low resistance measurements. Methods and guidance
Source: BSI Standards