BS IEC 63011-3:2018 Integrated circuits. Three dimensional integrated circuits Model and measurement conditions of through-silicon via

Electromagnetic compatibility
Test equipment
Electrical measurement
Impulse voltages
Impulse-voltage tests
Electronic equipment and components
Semiconductors
Integrated circuits
Transient voltages

Link: BS IEC 63011-3:2018 Integrated circuits. Three dimensional integrated circuits Model and measurement conditions of through-silicon via
Source: BSI Standards