Posted on March 28, 2019March 29, 2019 by Pulse AssentIEC TR 62878-2-7:2019 Device embedding assembly technology Guidelines – Accelerated stress testing of passive embedded circuit boards Link: IEC TR 62878-2-7:2019 Device embedding assembly technology Guidelines – Accelerated stress testing of passive embedded circuit boards Source: BSI Standards Related Posts:Government sets out plan to make UK a global…New multi-million pound Programme helps British SMEs…UK agrees new strategic partnership with SingaporeUK and Japan strengthen science and tech ties in TokyoMulti-million investment to turbocharge growth of…
