BS EN IEC 61188-6-4:2019 Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

Printed-circuit boards
Design
Electronic equipment and components
Dimensional tolerances
Integrated circuits
Dimensions
Printed circuits
Soldering

Link: BS EN IEC 61188-6-4:2019 Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Source: BSI Standards

BS ISO 18747-2:2019 Determination of particle density by sedimentation methods Multi-velocity approach

Liquids
Size
Particle size distribution
Sedimentation techniques
Diameter
Photoelectric devices
Particulate materials
Suspensions (chemical)
Sedimentation
Dispersants
Slurries
Dispersions (chemical)
Gravimetric analysis
Particle size measurement

Link: BS ISO 18747-2:2019 Determination of particle density by sedimentation methods Multi-velocity approach
Source: BSI Standards

BS EN IEC 61000-4-18:2019 Electromagnetic compatibility (EMC) Testing and measurement techniques. Damped oscillatory wave immunity test

Electrical testing
Electronic equipment and components
Testing conditions
Electromagnetic fields
Wave properties and phenomena
Electric power system disturbances
Waves
Circuits
Oscillations
Voltage
Electrical equipment
Performance testing
Electromagnetic compatibility
Electronic power supplies
Electromagnetic radiation
Waveforms
Test equipment
Electrical impedance

Link: BS EN IEC 61000-4-18:2019 Electromagnetic compatibility (EMC) Testing and measurement techniques. Damped oscillatory wave immunity test
Source: BSI Standards