Posted on July 3, 2019July 6, 2019 by Pulse AssentIEC 60749-20-1:2019 Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat Link: IEC 60749-20-1:2019 Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat Source: BSI Standards Related Posts:UK-Norway deal comes into effectPM announces new Trade Envoys to boost combined £54…New laws to introduce digital labelling for…Businesses to be given UK product marking flexibilityNew cyber laws to protect people’s personal tech…
