Posted on July 3, 2019July 6, 2019 by Pulse AssentIEC 60749-20-1:2019 Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat Link: IEC 60749-20-1:2019 Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat Source: BSI Standards Related Posts:UK calls for zero global shipping emissions by 2050…New proposals to strengthen medical devices…Next generation of heat networks to power UK's green…Plan to drive down the cost of clean heatUK-Norway deal comes into effect