Posted on July 3, 2019July 6, 2019 by Pulse AssentIEC 60749-20-1:2019 Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat Link: IEC 60749-20-1:2019 Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat Source: BSI Standards Related Posts:New laws to introduce digital labelling for…One-stop-shop to help businesses save money and go greenGovernment delivers over one billion pounds of…New plans to boost health in the workplace to keep…The UK Space Agency is Unlocking Space for Business
