Posted on July 3, 2019July 6, 2019 by Pulse AssentIEC 60749-20-1:2019 Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat Link: IEC 60749-20-1:2019 Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat Source: BSI Standards Related Posts:New laws to introduce digital labelling for…One-stop-shop to help businesses save money and go greenLandmark post-Brexit trade deals to come into force…Government delivers over one billion pounds of…UK’s thriving tech sector promoted to American…
