Posted on July 3, 2019July 6, 2019 by Pulse AssentIEC 60749-20-1:2019 Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat Link: IEC 60749-20-1:2019 Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat Source: BSI Standards Related Posts:New laws to introduce digital labelling for…Government delivers over one billion pounds of…The UK Space Agency is Unlocking Space for BusinessExpert regional innovation hubs given £75 million…UK government sets out AI Safety Summit ambitions
